IRVINE, Calif., November 2, 2010 – HID Global, trusted worldwide leader in solutions for the delivery of secure identity, today announced that it has obtained a site certificate for its Galway, Ireland e-government solutions manufacturing facility from the German Federal Office for Information Security (BSI), which supports product certifications conformance up to the Common Criteria assurance level EAL4+. The site certificate covers the initialization and production environments and processes for personal electronic identification (e-ID) products, including RFID inlays for e-passports and contactless national ID cards.
Common Criteria is an internationally approved set of rigorous security standards that ensures a clear and reliable evaluation of the security capabilities of information technology products for government customers, and site certificates from the BSI are accepted in all countries following the Common Criteria specifications.
“The Common Criteria certification of HID Global’s Galway, Ireland manufacturing facility reinforces our leadership in delivering world-class, highly secure e-government solutions,” said Jason Bohrer, senior vice president of operations with HID Global. "The certification coupled with our expansion of the Galway facility enables us to dramatically increase the production capacity of core components used in the manufacture of e-documents, e-passports, and e-national IDs to meet the growing worldwide demand for e-government solutions."
In its 2010 study entitled "The Global e-passport and e-visa Industry Report," Acuity Market Intelligence stated that 88 percent of all passports issued in 2014 will be electronic passports, with e-passport market revenues reaching nearly $7 billion annually by the end of 2014.
HID Global’s e-Government Solutions
With over 100 million product shipment to 28 countries worldwide, HID Global offers the broadest portfolio of e-documents, e-passport and e-national ID solutions in the market. HID is also the innovator and developer in the deployment of two of the most wide-spread technologies for extended durability of contactless e-documents—wire transfer and wire embedding technologies. Additionally, the company developed and patented ceFLEX™—a thin, flexible high-tech inlay material that increases e-document resiliency. identiCLASSTM , an e-ID embedded reader platform and the company’s most recent addition to its e-government portfolio, has be nominated as a finalist for the prestigious 2010 SESAME awards held on December 6 in Paris, France.
Director, Global Public Relations